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A Numerical Study on Flow Boiling in Parallel Microchannels

[+] Author Affiliations
Jinho Jeon, Woorim Lee, Youngho Suh, Gihun Son

Sogang University, Seoul, South Korea

Paper No. FEDSM2008-55136, pp. 95-102; 8 pages
doi:10.1115/FEDSM2008-55136
From:
  • ASME 2008 Fluids Engineering Division Summer Meeting collocated with the Heat Transfer, Energy Sustainability, and 3rd Energy Nanotechnology Conferences
  • Volume 1: Symposia, Parts A and B
  • Jacksonville, Florida, USA, August 10–14, 2008
  • Conference Sponsors: Fluids Engineering Division
  • ISBN: 978-0-7918-4840-1 | eISBN: 0-7918-3832-3
  • Copyright © 2008 by ASME

abstract

Flow boiling in parallel microchannels has received attention as an effective cooling method for high-power-density microprocessor. Despite a number of experimental studies, the bubble dynamics coupled with boiling heat transfer in microchannels is still not well understood due to the technological difficulties in obtaining detailed measurements of microscale two-phase flows. In this study, complete numerical simulation is performed to further clarify the physics of flow boiling in microchannels. The level set method for tracking the liquid-vapor interface is modified to include the effects of phase change and contact angle. The method is further extended to treat the no-slip and contact angle conditions on the immersed solid. Also, the reverse flow observed during flow boiling in parallel microchannels has been investigated. Based on the numerical results, the effects of channel shape and inlet area restriction on the bubble growth, reverse flow and heat transfer are quantified.

Copyright © 2008 by ASME

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