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A Micromachined Device Using Transient Hot-Wire Method for High Accuracy Thermal Conductivity Measurement of Semi-Rigid Materials

[+] Author Affiliations
Xin Liang, Weiping Ding, Zhiquan Shu, Dayong Gao

University of Washington, Seattle, WA

Xiaoming Zhou

University of Electronic Science and Technology of China, Chengdu, Sichuan, China

Paper No. BioMed2008-38038, pp. 71-72; 2 pages
  • ASME 2008 3rd Frontiers in Biomedical Devices Conference
  • ASME 2008 3rd Frontiers in Biomedical Devices Conference
  • Irvine, California, USA, June 18–20, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4833-7 | eISBN: 0-7918-3823-4
  • Copyright © 2008 by ASME


Based on the transient hot-wire method and well developed microfabrication techniques, a new thermal sensor, in which the microfabricated gold wire serves as both a heater and a thermometer, has been developed for measuring the thermal conductivities of semi-rigid materials. The intention that only one calibration constant is needed for an entire batch of sensors has been validated. Thermal conductivities of distilled water, ethylene glycol, dimethyl sulfoxide (DMSO), and apple at different temperatures have been obtained. Measurements are in agreement with suggested values. Complete results will be presented at the conference. The operating temperature of 0°C to 27°C has been tested and is anticipated to be −20°C to 60°C. In spite of conventional advantages, the presented sensor offers new exciting superior performance characteristics, such as reduced thermal resistivity and higher sensitivity, easier manufacturing for mass production, flexibility to reconfigure the sensor for samples with various sizes and shapes, and much reduced workload for system calibration.

Copyright © 2008 by ASME



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