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Integrated Micro-Channel Cooling in Industrial Applications

[+] Author Affiliations
C. C. S. Nicole, R. Dekker, A. Aubry, R. Pijnenburg

Philips Electronics Nederland BV, Eindhoven, The Netherlands

Paper No. ICMM2004-2397, pp. 673-677; 5 pages
doi:10.1115/ICMM2004-2397
From:
  • ASME 2004 2nd International Conference on Microchannels and Minichannels
  • ASME 2nd International Conference on Microchannels and Minichannels
  • Rochester, New York, USA, June 17–19, 2004
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4164-2
  • Copyright © 2004 by ASME

abstract

Experiments and simulations have been performed in order to assess the feasibility of integrated single phase forced convection in silicon micro-channels for the cooling of electronics. A silicon micro-channel device has been fabricated with channel size of 100 by 300 μm. Cooling has been achieved with a heater dissipating up to 370 W (750 W/cm2 ) with a flow rate of 0.1 1/min. In this case the maximum junction temperature was 130°C. This paper presents characteristics of such a cooling device as well as its description and fabrication. Experimental results are shown and compared with simulations. A description of a rough optimization of the channels size is given followed by comments describing the main advantages and drawbacks regarding industrial feasibility.

Copyright © 2004 by ASME

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