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Single-Phase Heat Transfer Enhancement Techniques in Microchannel and Minichannel Flows

[+] Author Affiliations
Mark E. Steinke, Satish G. Kandlikar

Rochester Institute of Technology, Rochester, NY

Paper No. ICMM2004-2328, pp. 141-148; 8 pages
doi:10.1115/ICMM2004-2328
From:
  • ASME 2004 2nd International Conference on Microchannels and Minichannels
  • ASME 2nd International Conference on Microchannels and Minichannels
  • Rochester, New York, USA, June 17–19, 2004
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4164-2
  • Copyright © 2004 by ASME

abstract

The single-phase heat transfer enhancement techniques are well established for conventional channels and compact heat exchangers. The major techniques include flow transition, breakup of boundary layer, entrance region, vibration, electric fields, swirl flow, secondary flow and mixers. In the present paper, the applicability of these techniques for single-phase flows in microchannels and minichannels is evaluated. The microchannel and minichannel single-phase heat transfer enhancement devices will extend the applicability of single-phase cooling for critical applications, such as chip cooling, before more aggressive cooling techniques, such as flow boiling, are considered.

Copyright © 2004 by ASME

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