Full Content is available to subscribers

Subscribe/Learn More  >

An Economic Study on Chemical Mechanical Polishing of Silicon Wafers

[+] Author Affiliations
Emmanuel A. Baisie, Man Yang, Ravindra Kaware, Maria Hooker, Z. C. Li

North Carolina Agricultural & Technical State University, Greensboro, NC

Wangping Sun

Oregon Institute of Technology, Klamath Falls, OR

X. H. Zhang

Seagate Technology, Minneapolis, MN

Paper No. MSEC2009-84072, pp. 691-697; 7 pages
  • ASME 2009 International Manufacturing Science and Engineering Conference
  • ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1
  • West Lafayette, Indiana, USA, October 4–7, 2009
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4361-1 | eISBN: 978-0-7918-3859-4
  • Copyright © 2009 by ASME


Chemical mechanical polishing (CMP) is used to remove irregularities on the silicon wafer surface. The importance of CMP is the achievement of both local and global planarity of wafer surface. This paper presents an economic study on CMP of silicon wafers. A cost model is developed to predict the total cost for CMP of silicon wafers. An input-output model is developed to analyze parameters relevant to the fixed cost and variable cost. The labor cost is investigated through a flow chart of the labor operation. Based on the cost model, a hypothetical case study is conducted to show the model’s capability of performing sensitivity analysis and identifying critical factors for the total cost for strategic management purposes.

Copyright © 2009 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In