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Experimental Investigations on Flatness and Subsurface Damage in Lapping of Substrate Wafers: A Literature Review

[+] Author Affiliations
Weilong Cong, Z. J. Pei, Pengfei Zhang

Kansas State University, Manhattan, KS

Paper No. MSEC2009-84068, pp. 683-689; 7 pages
  • ASME 2009 International Manufacturing Science and Engineering Conference
  • ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1
  • West Lafayette, Indiana, USA, October 4–7, 2009
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4361-1 | eISBN: 978-0-7918-3859-4
  • Copyright © 2009 by ASME


Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving desired flatness of wafer surfaces. A comprehensive literature review has been conducted on experimental investigations on lapping of substrate wafers. The review on material removal rate and surface roughness was published as a journal paper. As a follow-up, this paper reviews the literature on flatness and subsurface damage in lapping of substrate wafers. It presents reported experimental results on effects of process parameters on flatness and subsurface damage.

Copyright © 2009 by ASME



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