0

Full Content is available to subscribers

Subscribe/Learn More  >

Experimental Investigations on Flatness and Subsurface Damage in Lapping of Substrate Wafers: A Literature Review

[+] Author Affiliations
Weilong Cong, Z. J. Pei, Pengfei Zhang

Kansas State University, Manhattan, KS

Paper No. MSEC2009-84068, pp. 683-689; 7 pages
doi:10.1115/MSEC2009-84068
From:
  • ASME 2009 International Manufacturing Science and Engineering Conference
  • ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1
  • West Lafayette, Indiana, USA, October 4–7, 2009
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4361-1 | eISBN: 978-0-7918-3859-4
  • Copyright © 2009 by ASME

abstract

Lapping is an important material-removal process for manufacturing of substrate wafers. Objectives of lapping include removing subsurface damage in sliced wafers, thinning wafers to target thickness, and achieving desired flatness of wafer surfaces. A comprehensive literature review has been conducted on experimental investigations on lapping of substrate wafers. The review on material removal rate and surface roughness was published as a journal paper. As a follow-up, this paper reviews the literature on flatness and subsurface damage in lapping of substrate wafers. It presents reported experimental results on effects of process parameters on flatness and subsurface damage.

Copyright © 2009 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In