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Diamond Disc Pad Conditioning in Chemical Mechanical Polishing: A Literature Review of Process Modeling

[+] Author Affiliations
Emmanuel A. Baisie, Z. C. Li

North Carolina Agricultural & Technical State University, Greensboro, NC

X. H. Zhang

Seagate Technology, Minneapolis, MN

Paper No. MSEC2009-84033, pp. 661-670; 10 pages
doi:10.1115/MSEC2009-84033
From:
  • ASME 2009 International Manufacturing Science and Engineering Conference
  • ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1
  • West Lafayette, Indiana, USA, October 4–7, 2009
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4361-1 | eISBN: 978-0-7918-3859-4
  • Copyright © 2009 by ASME

abstract

Chemical Mechanical Polishing (CMP) is a major manufacturing step extensively used to planarize semiconductor wafers. In CMP, the polishing pad surface is glazed by residues. A diamond disc conditioner is used to dress the pad to regenerate new pad profile and asperity in order to maintain favorable process conditions. This paper presents a review on process modeling of diamond disc pad conditioning in CMP. Following the introduction, the paper briefly introduces a technical background of the conditioning process and process control. It then summarizes research work on the various analytical process models proposed and ends with conclusions and topics for future research.

Copyright © 2009 by ASME

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