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Modelling Reliability of Power Electronics Packaging

[+] Author Affiliations
Chris Bailey, Hua Lu, Chunyan Yin

University of Greenwich, London, UK

Paper No. InterPACK2009-89430, pp. 215-220; 6 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 2
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4360-4 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Power Electronics uses semiconductor technology to convert and control electrical power. Demands for efficient energy management, conversion and conservation, and the increasing take up of electronics in transport systems (i.e. all electric car) there has been tremendous growth in the use of power electronics semiconductor devices such as Insulated Gate Bipolar Transistors (IGBT’s). The packaging of the power electronics devices involves a number of challenges for design engineers in terms of reliability and thermal management. For example IGBT modules will contain a number of semiconductor dies within a small footprint bonded to substrates with aluminium wires and wide area solder joints. The reliability of the package will depend on thermo-mechanical behavior of these materials. This paper details the results from a major UK project involving academics and industrial partners to investigate the reliability of IGBT modules. The focus of the presentation will be on the modelling tools developed to predict reliability and also the development of prognostics techniques to predict the remaining life of the package.

Copyright © 2009 by ASME



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