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Deformation of Resin Material Due to Curing in the Thermal Process

[+] Author Affiliations
Ryusuke Sone, Qiang Yu, Tadahiro Shibutani

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. InterPACK2009-89353, pp. 953-958; 6 pages
doi:10.1115/InterPACK2009-89353
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Electronic devices have been developed with the transition of structures and materials. However, in the development, the miniaturization and the high integration of electronic device parts have been accorded priority over mechanical strength reliability. As a result, a lot of reliability issues have been exposed. Connective reliability issue which arises from warpage is one of the most important of them all in high integration electronic devices. To evaluate this warpage accurately, this paper focused on curing of resin materials which used in electronic devices during the thermal process. The deformation and the warpage behavior which arises from curing of resin materials were clarified by examinations. And the mechanism of the warpage of resin materials receiving the thermal loads was examined.

Copyright © 2009 by ASME

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