Full Content is available to subscribers

Subscribe/Learn More  >

Deformation of Resin Material Due to Curing in the Thermal Process

[+] Author Affiliations
Ryusuke Sone, Qiang Yu, Tadahiro Shibutani

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. InterPACK2009-89353, pp. 953-958; 6 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Electronic devices have been developed with the transition of structures and materials. However, in the development, the miniaturization and the high integration of electronic device parts have been accorded priority over mechanical strength reliability. As a result, a lot of reliability issues have been exposed. Connective reliability issue which arises from warpage is one of the most important of them all in high integration electronic devices. To evaluate this warpage accurately, this paper focused on curing of resin materials which used in electronic devices during the thermal process. The deformation and the warpage behavior which arises from curing of resin materials were clarified by examinations. And the mechanism of the warpage of resin materials receiving the thermal loads was examined.

Copyright © 2009 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In