Full Content is available to subscribers

Subscribe/Learn More  >

Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

[+] Author Affiliations
Hiromi Sugihara, Masanori Yamagiwa, Masato Fujita, Toshikazu Oshidari, Qiang Yu

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. InterPACK2009-89342, pp. 937-943; 7 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


The power electronics equipments for Electric vehicles such as the inverter are strongly demanded on downsizing and weight reduction. For these requirements, Silicon Carbide (SiC) devices are receiving particular attention. SiC devices are characterized by lower-loss and higher temperature operation compared with Si devices. Using the devices under high temperature, the cooling equipments can be miniaturized. However, a function of stress relaxation that the existing solder has is difficult to be expected in a high-temperature-resistant joint layer for SiC devices, because the joint layer is generally hard. So, the authors have proposed a new mounting structure that a metal circuit on a substrate has the function instead of the joint layer. In this study, high-temperature-resistant mounting structures that the chip was bonded by low temperature sintering method using Ag nano-particles to substrate with Ag/Ni plating are prepared. Thermal Cycle Test (TCT) using these samples of harsh temperature range was conducted. As a result a new critical issue on the chip joint was identified. To clarify the thermal fatigue mechanism, the Finite-Element-Analysis (FEA) was carried out. The analysis model simulated a thin layer of Ag/Ni plating and the high-temperature-resistant joint layer. By the FEM results, the thermal fatigue, particularly occurring crack, was affected by the micro structures.

Copyright © 2009 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In