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Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

[+] Author Affiliations
Kisho Ashida, Kenya Kawano, Naotaka Tanaka

Hitachi, Ltd., Hitachinaka, Japan

Atsushi Nishikizawa, Nobuya Koike

Renesas Technology Corp., Hitachinaka, Japan

Paper No. InterPACK2009-89273, pp. 825-831; 7 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure. First, we assumed that the fracturing was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the silver paste fracture strength using a three-point bending test and a bonded specimen with silver paste. Finally, we predicted the occurrence of silver paste fracturing by calculating the silver paste stress during reflow soldering process and comparing it with the measured fracture strength. Results obtained in strength evaluation analysis were consistent with those obtained in package reflow tests, indicating that this method can be used to predict the occurrence of silver paste fracturing.

Copyright © 2009 by ASME



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