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Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

[+] Author Affiliations
Yoshihiko Kanda, Kunihiro Zama

Graduate School of Shibaura Institute of Technology, Tokyo, Japan

Yoshiharu Kariya

Shibaura Institute of Technology, Tokyo, Japan

Takao Mikami, Takaya Kobayashi

Mechanical Design & Analysis Corporation, Chofu, Tokyo, Japan

Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

Namics Corporation, Niigata, Japan

Paper No. InterPACK2009-89152, pp. 755-759; 5 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg , specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg , and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

Copyright © 2009 by ASME



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