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Life Prediction of SAC305 Interconnects Under Temperature Cycling Conditions Using an Arbitrary Loading Fatigue Model

[+] Author Affiliations
Dominik Herkommer, Jeff Punch, Michael Reid

University of Limerick, Limerick, Ireland

Paper No. InterPACK2009-89105, pp. 737-742; 6 pages
doi:10.1115/InterPACK2009-89105
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.

Copyright © 2009 by ASME

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