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Solder Joint Electromigration Mechanisms

[+] Author Affiliations
Pilin Liu, Shenquan Ou, Zezhong Fu, Goyal Deepak

Intel Co., Chandler, AZ

Fan-yi Ouyang

Intel Co., Hillsboro, OR

Paper No. InterPACK2009-89023, pp. 703-709; 7 pages
doi:10.1115/InterPACK2009-89023
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Kelvin structure resistant monitoring and cross-sectional in-situ SEM observation. It was observed that package substrate process may play a role on how much portion of the life time that void nucleation and propagation could take respectively. Package warpage also played an important role on electromigration performance.

Copyright © 2009 by ASME

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