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Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

[+] Author Affiliations
Stephen L. Hodson, Xianfan Xu, Timothy S. Fisher

Purdue University, West Lafayette, IN

Thiruvelu Bhuvana

Burke Nanotechnology Center, West Lafayette, IN; Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore, India

Baratunde A. Cola

Georgia Institute of Technology, Atlanta, GA

G. U. Kulkarni

Jawaharlal Nehru Centre for Advanced Scientific Research, Bangalore, India

Paper No. InterPACK2009-89352, pp. 631-635; 5 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Carbon nanotube (CNT) arrays are attractive thermal interface materials with high compliance and conductance that can remain effective over a wide temperature range. Here we study CNT interface structures in which free CNT ends are bonded using palladium hexadecanethiolate Pd(SC16 H35 )2 to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.

Copyright © 2009 by ASME



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