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Analysis of Nanofluids in Liquid Electronic Cooling Systems

[+] Author Affiliations
N. A. Roberts, D. G. Walker

Vanderbilt University, Nashville, TN

Paper No. InterPACK2009-89327, pp. 617-622; 6 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Nanofluids are solutions of a small fraction of suspended nanoparticles in a bulk fluid. Nanofluids have shown great promise as heat transfer fluids over typically used bulk fluids and fluids with micron sized particles. The nanoparticles do not settle in the fluid and do not cause clogging or damage to surfaces as with micron sized particles. In the current work we compare the performance of different volume loadings of water-based alumina nanofluids in a commercially available electronics cooling system to that of pure DI-water. The commercially available system is a water block used for liquid cooling of a computational processing unit. The size of the nanoparticles in the study is varied from 20 nm to 30 nm. Results show an enhancement in convective heat transfer, but not in the temperature increase through a heated tube or commercial cooling system in nanofluids with volume loadings of nanoparticles up to 2% by volume. The current nanofluids showed significant settling within an hour of preparation.

Copyright © 2009 by ASME



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