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The IP Landscape for MEMS Packaging

[+] Author Affiliations
Charles E. Bauer

TechLead Corporation, Portland, OR

Raymond A. Fillion

TechLead Corporation, Niskayuna, NY

Herbert J. Neuhaus

TechLead Corporation, Colorado Springs, CO

Marc Papageorge

Semiconductor Outsourcing Solutions, Pleasanton, CA

Paper No. InterPACK2009-89291, pp. 497-500; 4 pages
doi:10.1115/InterPACK2009-89291
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Early MEMS devices employed packages developed for conventional semiconductor microelectronics. Today, MEMS packages reflect the unique environment, mechanical, chemical and thermal requirements of MEMS devices themselves. A casual search of on-line databases reveals nearly 40,000 patents worldwide containing the words “MEMS” and “package.” While not all relevant, the number of IP documents easily overwhelms researchers, investors and IP practitioners. The authors systematically analyze the relevant IP and organize it by generic technology categories. A unique mapping methodology provides greater understanding of the landscape of IP in the MEMS packaging arena across a wide range of considerations including geography, IP development and ownership trends, infrastructure implications and application concepts. The authors also present a rudimentary valuation of IP within the MEMS packaging field based on citation analysis. Finally, the authors demonstrate a method to develop a strategic framework based on the IP landscape useful for investment, market development and strategic alliance planning.

Copyright © 2009 by ASME
Topics: MEMS packaging

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