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Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

[+] Author Affiliations
Benjamin Lemke, Oliver Paul

University of Freiburg, Freiburg, Germany

Rajashree Baskaran

Intel Corporation, Chandler, AZ

Paper No. InterPACK2009-89171, pp. 463-469; 7 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


This paper discusses the measurement opportunities arising from a novel piezoresistance sensor featuring vertical currents. Temperature-compensated measurements of a sum of the three normal stress components including the vertical normal stress, are presented. In specific applications with sensors located at free surfaces where the vertical normal stress component vanishes, a combination of this temperature-compensated measurement and a pseudo-Hall measurement yields the individual in-plane normal stresses. Furthermore, the temperature-uncompensated extraction of the vertical normal stress component is discussed with respect to the new measurement possibilities provided by the presented sensor. A sensitivity analysis illustrates the influence of individual uncertainty sources to the overall uncertainty of the measurement. Based on these results possible improvements in stress detection are suggested.

Copyright © 2009 by ASME



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