0

Full Content is available to subscribers

Subscribe/Learn More  >

Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire

[+] Author Affiliations
Yingwei Jiang, Ronglu Sun

Tianjin Polytechnic University, Tianjin, China

Sonder Wang, Youmin Yu, Weimin Chen, Xiao Wei

Freescale Semiconductor (China) Ltd., Tianjin, China

Kenny Tan

ASM Technology Singapore Pte Ltd., Singapore

Paper No. InterPACK2009-89046, pp. 451-457; 7 pages
doi:10.1115/InterPACK2009-89046
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

In IC package assembly, copper (Cu) wire bonding is a developing alternative interconnection technology for its advantages of more cost saving and better mechanical and electrical characteristics than gold (Au) and aluminum (Al) wires. This paper discusses experimental development of 6mil Cu wire bonding on ASM wire bonder to replace 15mil Al wire in a power IC package. It covers wire and tool selection, wire bonding process development, wire bonding integrity inspection and reliability study. The wire and tool selection includes wire type, capillary and wire bonder. The process development focuses on two crucial stages, Free Air Ball (FAB) formation and bonding process window development. DOE approach is introduced into the process development. The experimental studies show that flow rate of forming gas is a key factor to form the qualified FAB and a workable process window is established. Wire pull and ball shear tests are conducted to measure wire bonding strength of the built samples based on the criteria of JEDEC. Meanwhile, crater test and Zygo’s 3-D measurement are carried out to inspect any risk of underlying metal integrity in die before reliability tests. The data discloses that sufficient Al bond pad thickness is needed to avoid underlying metal damage during bonding process. The results of the two reliability tests, High Temperature Baking (HTB) and Pre-Condition (PC) & Temperature Cycle (TC), show that Cu/AL IMC growth is slow and accordingly lifetime of product may significantly extend. The overall result of the study finally indicates that with current thermosonic ball bonder, 6mil Cu wire is feasible to replace heavy 10–15mil Al wire in power package assembly.

Copyright © 2009 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In