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Electroless Nickel Plating Process Optimization for Aluminum Terminals

[+] Author Affiliations
Philip Westby, Kevin Mattson, Fred Haring, Jacob Baer, Matt Steele, Syed Sajid Ahmad, Aaron Reinholz

North Dakota State University, Fargo, ND

Paper No. InterPACK2009-89131, pp. 371-378; 8 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


An Electroless Ni plating process for aluminum was evaluated and optimized, leading to smooth and uniform nickel growth approaching 28.2 μm/hr. The effects of temperature, and process time were investigated. Nickel bumping die for solder adhesion was performed and the quality of the adhesion between the nickel and aluminum layers was evaluated.

Copyright © 2009 by ASME



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