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Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

[+] Author Affiliations
John Zhiyuan Yang

Peregrine Semiconductor, San Diego, CA

Paper No. InterPACK2009-89199, pp. 253-259; 7 pages
doi:10.1115/InterPACK2009-89199
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

This paper presents packaging solution for silicon on sapphire based commercial RF IC products for which package type is focused on traditional plastic packages such as MSOP, TSSOP, QFN and recently developed ultra thin QFN package. Package mechanical performance, reliability evaluation and electrical performance have been addressed.

Copyright © 2009 by ASME

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