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Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

[+] Author Affiliations
Toshiki Hirogaki, Eiichi Aoyama, Tsuyoshi Okawa

Doshisha University, Kyotanabe, Kyoto, Japan

Keiji Ogawa

The University of Shiga Prefecture, Hikone, Shiga, Japan

Paper No. InterPACK2009-89060, pp. 219-227; 9 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Recently, printed wiring boards (PWBs), which are employed in electronic devices, have been miniaturized, lightened, and made multifunctional. This trend demands the improvement of drilling technology and a method to raise productivity. In this study, as a processing sample, we use the aramid fiber-reinforced printed wiring board (AFRP) of the next generation PWB, which is attracting attention, and GFRP, which is most commonly used. We investigate the processing temperature and the processing quality and conduct number optimization of the sheets to improve productivity by increasing their number.

Copyright © 2009 by ASME



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