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Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

[+] Author Affiliations
F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

University of Maryland, College Park, MD

S. Tolchinsky, J. Crystal

Arbitron Inc., Columbia, MD

Paper No. InterPACK2009-89179, pp. 149-154; 6 pages
doi:10.1115/InterPACK2009-89179
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

The dynamic response of electronic assemblies to drop and shock conditions is investigated through tests and simulation. The portable electronic product tested in this study consists of a circuit card assembly and a battery pack supported in a two-piece plastic housing with a separate battery compartment. Dynamic loading, consisting of various shock profiles, is applied using an electrodynamic shaker. A number of drop tests are also conducted on a drop tower. Fourier Transform technique (FFT) is utilized to analyze the dynamic response of the PWB and the plastic housing in the frequency domain. The loading events are modeled in ABAQUS™ [11]. Flexural strains and accelerations are compared to assess the agreement between the model results obtained here and the experimental results [10]. The long-term goal of this study is to demonstrate a systematic computational capability to predict the dynamic response and failure modes expected due to drop loading, during the design phase of future products.

Copyright © 2009 by ASME

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