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Thermal-Structural Performance of Orthotropic Pin Fin Applications

[+] Author Affiliations
Abul Fazal M. Arif, Syed M. Zubair

King Fahd University of Petroleum & Minerals, Dhahran, Saudi Arabia

Paper No. InterPACK2009-89125, pp. 125-134; 10 pages
doi:10.1115/InterPACK2009-89125
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Thermally conductive composites as compared to metals have reduced density, decreased corrosion, oxidation, and chemical resistance, as well as adjustable properties to fit a given application. However, there are several challenges that need to be addressed before they can be successfully utilized in heat sink design. The interface between the device and thermal product that is used to cool it is an important factor in the thermal network designs of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure and thermal stress level can attain undesirable values. In this paper, we investigate the effect of thermal interface between the fin and base plate on thermalstructural behavior of heat sinks. A coupled-field (thermal-structural) analysis using finite element method is performed to predict temperature as well as stress fields in the region of interface. In addition temperature and heat transfer rate predictions is supported through analytical results. Effect of various interface properties (such as air gap with rough surface and gaps filled with interface material) on the resulting thermal-structural response of the pin fin is investigated with respect to four interface materials combinations.

Copyright © 2009 by ASME

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