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Integrating Novel Packaging Technologies for Large Scale Computer Systems

[+] Author Affiliations
James Mitchell, Robert Drost, Ron Ho

Sun Microsystems, Inc., Menlo Park, CA

John Cunningham, Ashok V. Krishnamoorthy

Sun Microsystems, Inc., San Diego, CA

Paper No. InterPACK2009-89355, pp. 57-66; 10 pages
doi:10.1115/InterPACK2009-89355
From:
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Proximity Communication (PxC) enables VLSI chips placed face-to-face to communicate using close-field capacitive coupling. In a 90 nm standard CMOS technology, using the packaging techniques described in this paper, PxC provides chip-to-chip latency of 2.5 ns at 4 Gb/s per channel with less than 2.5 mW/Gb/s, an areal bandwidth density of 0.83 Tb/s/mm2 , and a BER less than 10−15 . At a system level, the benefits of PxC scale directly with the number of chips that can be packaged together, because PxC enables designers to aggregate multiple chips that perform as a single large piece of silicon. The chips can also be heterogeneous to provide an optimized mix of process technology and functionality, such as integrating DRAM chips, NAND flash memory, and CMOS processor chips. In this paper we describe packaging advances and technology prototypes that enable PxC and provide its system-level benefits.

Copyright © 2009 by ASME
Topics: Computers , Packaging

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