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Flat Tree Networks

[+] Author Affiliations
P. Khanduri, A. Wood, D. Cohen

Sun Microsystems, Inc., Menlo Park, CA

I. Birkeli

Sun Microsystems, Inc., Oslo, Norway

F. Sem-Jacobsen

Simula Research, Oslo, Norway

Paper No. InterPACK2009-89336, pp. 49-55; 7 pages
  • ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
  • ASME 2009 InterPACK Conference, Volume 1
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-4359-8 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


Hierarchical switching networks connecting hundreds to thousands of servers are common in most large corporations. The state-of-the-art switches used in those networks are usually implemented by interconnecting a set of line cards that connect to hosts with a set of fabric cards that connect to other switches. This paper presents a new approach to implementing those switches using innovative packaging techniques that permit the 3-dimensional line/fabric card structure to be flattened into a 2-dimensional array of switch chips packaged on a PCB. The result of this flattening is a non-hierarchical network topology that we call a “flat tree”. This new approach reduces cost and complexity while improving performance and signal integrity.

Copyright © 2009 by ASME



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