Full Content is available to subscribers

Subscribe/Learn More  >

Characterization of Electronic Packages by Thermal Diffusion Tomography

[+] Author Affiliations
Hakan Erturk

Bogazici University, Istanbul, Turkey

Paper No. HT2009-88380, pp. 249-258; 10 pages
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4357-4 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


One of the most important functions of an electronic package is thermal management, as package is responsible from removing the heat generated by the transistors to ensure reliability. The quality of the package is very important for proper thermal management and it is important to have minimal flaws that increase thermal resistance of the package. Therefore, detection of flaws in the multi-layered package is critical during the assembly process development to monitor the package quality. This is achieved by techniques such as computerized tomography (CT) using x-rays, or scanning acoustic microscopy (SAM), all of which require very expensive equipment and significant processing time. Thermal diffusion tomography (TDT) can be used for detecting the flaws as a lower cost alternative to these imaging techniques. The feasibility of TDT as a fault detection technique for electronic packages with IR thermometry is considered in the current study. Two reconstruction algorithms considered; an iterative perturbation approach and Levenberg-Marquard method were found to be capable of detecting the flaws in the thermal interface layer.

Copyright © 2009 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In