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Characterization of Electronic Packages by Thermal Diffusion Tomography

[+] Author Affiliations
Hakan Erturk

Bogazici University, Istanbul, Turkey

Paper No. HT2009-88380, pp. 249-258; 10 pages
doi:10.1115/HT2009-88380
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4357-4 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

One of the most important functions of an electronic package is thermal management, as package is responsible from removing the heat generated by the transistors to ensure reliability. The quality of the package is very important for proper thermal management and it is important to have minimal flaws that increase thermal resistance of the package. Therefore, detection of flaws in the multi-layered package is critical during the assembly process development to monitor the package quality. This is achieved by techniques such as computerized tomography (CT) using x-rays, or scanning acoustic microscopy (SAM), all of which require very expensive equipment and significant processing time. Thermal diffusion tomography (TDT) can be used for detecting the flaws as a lower cost alternative to these imaging techniques. The feasibility of TDT as a fault detection technique for electronic packages with IR thermometry is considered in the current study. Two reconstruction algorithms considered; an iterative perturbation approach and Levenberg-Marquard method were found to be capable of detecting the flaws in the thermal interface layer.

Copyright © 2009 by ASME

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