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Fluid Flow and Heat Transfer Characteristics of Ethylene Glycol and Water in Copper-Based Microchannel Devices

[+] Author Affiliations
Fanghua Mei, B. Lu, W. J. Meng, S. Guo

Louisiana State University, Baton Rouge, LA

Paper No. HT2009-88328, pp. 885-895; 11 pages
doi:10.1115/HT2009-88328
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Metal-based microchannel heat exchangers (MHEs) offer potential solutions to applications demanding high heat flux removal, such as cooling of high-performance microelectronic and energy-efficient lighting modules. Efficient fabrication of metal-based MHEs and quantitative flow and heat transfer measurements on them are critical for establishing the economic and technical feasibility of such devices. Adopting metal-based MHEs in many applications demands quantification of flow and heat transfer performance with application-relevant coolants, e.g. ethylene glycol (EG)/water mixtures rather than pure water. As a first step in this direction, we report here fabrication and assembly of all-Cu MHE prototypes, as well as results of flow and heat transfer testing using pure EG and pure water as the fluid medium. Results of heat transfer testing indicate sensitivity of overall heat transfer performance to entrance length effects, which in the case of pure EG, is significantly influenced by its physical properties under the testing condition.

Copyright © 2009 by ASME

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