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Saturation Boiling of PF-5060 Dielectric Liquids on Micro-Porous Copper Dendrites Surfaces

[+] Author Affiliations
Mohamed S. El-Genk, Amir F. Ali

University of New Mexico, Albuquerque, NM

Paper No. HT2009-88266, pp. 847-855; 9 pages
doi:10.1115/HT2009-88266
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on micro-porous copper dendrites surface layers deposited on 10 × 10 mm Cu substrates. The electrochemically deposited surface layers are of different thickness (50, 70, and 220 μm), average pore size (15, 30 and 80 μm) and volume porosity (96, 94.3, and 93.6%). The thickest layer, deposited using 3.0 A/cm2 for 25s, gives the best results: the saturation CHF of 25.27 W/cm2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, hMNB , near the end of the fully developed nucleate boiling region is 8.76 W/cm2 .K. In addition, nucleate boiling begins at surface temperature slightly above saturation (< 0.5 K) with no temperature excursion. The temperature excursions before initiating boiling on the 70 μm and 50 μm thick Cu nano-dendrites surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of ∼ 55.1 °C and 57.4 °C, respectively. These temperatures are much lower than recommended (85 °C) for reliable operation of most silicon electronics and CPUs.

Copyright © 2009 by ASME

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