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Low-Profile Chipset Microprocessor Heatsink Optimization for Server Form Factor

[+] Author Affiliations
Ali Akbar Merrikh, Sridhar Sundaram, David Walshak, Tom Dolbear

Advanced Micro Devices, AMD, Austin, TX

Yizhang Yang

Advanced Micro Devices, AMD, Sunnyvale, CA

Paper No. HT2009-88036, pp. 747-754; 8 pages
doi:10.1115/HT2009-88036
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

We present a methodology for optimizing footprint, metal mass and thermal performance of an aluminum extruded heatsink for cooling chipset microprocessors in server form-factor. The analysis is based on predefined volume flow rate of air at a constant temperature assumed to be available upstream of the package. The front-to-back cooling assumption covers the worst case ambient conditions, typical of chipset boundary condition in servers. We present studies covering a range of heatsink footprints in order to compare and minimize the heatsink footprint, at the same time satisfying thermal specification of the chipset microprocessor. The study also focuses on the system-level assessment of the optimum 60×40 mm2 footprint and corner cases by studying the effect of motherboard thermal conductivity as well as blockages on the heatsink case-to-ambient thermal resistance.

Copyright © 2009 by ASME

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