0

Full Content is available to subscribers

Subscribe/Learn More  >

An Efficient Wavy Microchannel Heat Sink for Electronic Devices

[+] Author Affiliations
Y. Sui, C. J. Teo, P. S. Lee, Y. T. Chew, C. Shu

National University of Singapore, Singapore

Paper No. HT2009-88585, pp. 719-725; 7 pages
doi:10.1115/HT2009-88585
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

In this paper, we have designed a compact and efficient liquid-cooled heat sink for mini-sized electronic devices, particularly for very-large-scale integrated (VLSI) circuits. The heat sink can either be an integral part of the silicon (or metal) substrate, or a separate part attached onto the substrate. The heat sink consists of several wavy microchannels, with hydraulic diameter on the order of 100 μm, microfabricated on a silicon or metal substrate. The fluid flow and heat transfer performance of the heat sink are studied using numerical simulations in the steady laminar flow region and the dynamical system technique using Poincaré sections is employed to analyze the fluid mixing. It is found that when the liquid coolant flows through the wavy microchannel, Dean vortices can develop. The quantity and location of the Dean vortices may change along the flow direction, which can lead to laminar chaos. The chaotic advection greatly enhances the fluid mixing, and thus the heat transfer performance of the present heat sink is much more superior than previous designs which employed straight microchannels. It is also found that the pressure drop penalty is much smaller that the heat transfer enhancement for the present heat sink. Furthermore, the relative wavy amplitude (wavy amplitude/wavelength) of the channels can be varied along the flow direction for various purposes, without compromising the compactness and efficiency of the heat sink. The relative waviness can be increased along the flow direction, which results in higher heat transfer coefficients and renders the temperature for the devices much more uniform. The relative waviness can also be designed to be higher in regions of high heat flux for hot spot mitigation purposes.

Copyright © 2009 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In