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Experimental Investigation of Closed Loop Pulsating Heat Pipe With Nanofluids

[+] Author Affiliations
Hamed Jamshidi, Sajad Arabnejad, Mohammad Behshad Shafii, Yadollah Saboohi, Ramin Rasoulian

Sharif University of Technology, Tehran, Iran

Paper No. HT2009-88381, pp. 675-683; 9 pages
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME


In this paper, the effect of several different parameters on the thermal resistance of a Closed Loop Pulsating Heat Pipe (CLPHP) has been investigated. These parameters include the working fluid, the inclination angle, the filling ratio and the heat influx. Also, the impact of using nanofluids with different nano-particle concentrations has been analyzed. It was observed that a CLPHP can increase the heat transfer up to 11.5 times compared to an empty pipe. Optimum performance for a system with the water-silver nanofluid was achieved at conditions of 50% filling ratio and 0.9 K/W of thermal resistance, and for the water-titanium oxide system, these optimal conditions were found to be 40% filling ratio and 0.8 K/W of thermal resistance. In addition, the optimum performance for pure water occurs at a filling ratio of 40% and a thermal resistance of 1.15 K/W. The nanofluid reduces the thermal resistance by 30%. With a decrease in the concentration of nano-particles in the base fluid, the performance of the system decreases as well and the total thermal resistance increases. In low powers (under 20 W), the two-phase flow pattern inside the pipes was slug-plug, but in higher powers (over 30 W), this changed to an annular flow. The performance of the system was better in the annular mode, but there was a probability of dry out and sudden increase of condenser temperature.

Copyright © 2009 by ASME



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