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Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques

[+] Author Affiliations
Patrick E. Hopkins, Justin R. Serrano, Leslie M. Phinney

Sandia National Laboratories, Albuquerque, NM

Paper No. HT2009-88269, pp. 497-503; 7 pages
doi:10.1115/HT2009-88269
From:
  • ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
  • Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment
  • San Francisco, California, USA, July 19–23, 2009
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4356-7 | eISBN: 978-0-7918-3851-8
  • Copyright © 2009 by ASME

abstract

Pump-probe transient thermoreflectance (TTR) techniques are powerful tools for measuring thermophysical properties of thin films, such as thermal conductivity, Λ, or thermal boundary conductance, G. TTR experimental setups rely on lock-in techniques to detect the response of the probe signal relative to the pump heating event. The temporal decays of the lock-in signal are then compared to thermal models to deduce the Λ and G in and across various materials. There are currently two thermal models that are used to relate the measured signals from the lock-in to the Λ and G in the sample of interest. In this work, the thermal models, their assumptions, and their ranges of applicability are compared. The advantages and disadvantages of each technique are elucidated from the results of the thermophysical property measurements.

Copyright © 2009 by ASME

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