0

Full Content is available to subscribers

Subscribe/Learn More  >

An Experimental Investigation of the Miniature Loop Heat Pipe Cooling Systems for High Power Density Computer Chips

[+] Author Affiliations
Jeehoon Choi

Zalman Tech Co., Ltd., Seoul; Sungkyunkwan University, Suwon, South Korea

Junghyun Yoo

Zalman Tech Co., Ltd., Seoul, South Korea

Byungho Sung, Chulju Kim

Sungkyunkwan University, Suwon, South Korea

Diana-Andra Borca-Tasciuc

Rensselaer Polytechnic Institute, Troy, NY

Paper No. ICNMM2011-58218, pp. 421-426; 6 pages
doi:10.1115/ICNMM2011-58218
From:
  • ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1
  • Edmonton, Alberta, Canada, June 19–22, 2011
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4463-2
  • Copyright © 2011 by ASME

abstract

The implementation of high power density, multi-core central and graphic processing units (CPUs and GPUs) coupled with higher clock rates of the high-end computing hardware requires enhanced cooling technologies able to attend high heat fluxes while meeting strict design constrains associated with system volume and weight. Miniature loop heat pipe (mLHP) systems emerge as one of the technologies best suited to meet all these demands. This paper investigates experimentally a mLHP system designed for workstation CPUs. The system incorporates a two-phase flow loop with capillary driving force. Since there is a strong demand for miniaturization in commercial applications, emphasize was also placed on physical size during the design stage of the new system. Hence system weight is reduced to around 450g, significantly smaller than that of commercial coolers consisting of copper heat sinks that weight around 782g. Experimental characterization shows that the system can reach a maximum heat transfer rate of 170W with an overall thermal resistance of 0.12 K/W. The heat flux is 18.9 W/cm2 , approximately 30% higher than that of larger size commercial systems. To further miniaturize the evaporator module while maintaining the same heat flux, a new structure for the porous evaporator is proposed, which consist of a porous bi-layer, with nanopores at the top surface. The role of the nanoporous layer is to provide a larger surface area for phase-change, enhancing the evaporation rate.

Copyright © 2011 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In