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Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper

[+] Author Affiliations
Shinji Koyama, Yukinari Aoki, Ikuo Shohji

Gunma University, Kiryu, Gunma, Japan

Paper No. IPACK2011-52072, pp. 701-705; 5 pages
doi:10.1115/IPACK2011-52072
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME

abstract

The effect of citric-acid surface modification on the bond strength of the solid-state bonded interface of tin and copper has been investigated by SEM observation of the interfacial microstructures and fractured surfaces. Citric-acid surface modification was carried out in a vacuum chamber at a bonding temperature of 383–473 K and a bonding pressure of 7 MPa (bonding time: 1800 s). The citric-acid surface modification decreased bonding temperature by 70 K at which bonded joints could be obtained and bond strength comparable with the base metal was achieved.

Copyright © 2011 by ASME
Topics: Copper , Bond strength

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