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Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

[+] Author Affiliations
Naoya Matsubara, Ikuo Shohji

Gunma University, Kiryu, Gunma, Japan

Hideyuki Kuwahara

MPT, Kyoto, Kyoto, Japan

Paper No. IPACK2011-52026, pp. 673-676; 4 pages
doi:10.1115/IPACK2011-52026
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME

abstract

The erosion behavior of plasma nitriding SUS304 stainless steel by molten lead-free solder was examined. Plasma nitriding treatment was conducted to the surface of SUS304 steel. The thickness of the nitriding layer was approximately 17 μm. The layer mainly consists of Fe4 N, CrN and Cr2 N. Erosion of nitriding SUS304 stainless steel was observed after erosion test with molten Sn-3Ag-0.5Cu (mass%) solder at 450°C for 100 h. On the basis of the result of microstructure observation, it was found that Sn diffusion into the nitrided layer occurred in non eroded area. The result shows that Sn diffusion into the nitrided layer induces erosion of plasma nitriding stainless steel.

Copyright © 2011 by ASME

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