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Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

[+] Author Affiliations
Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh

Gunma University, Kiryu, Gunma, Japan

Norio Nemoto

Japan Aerospace Exploration Agency, Tsukuba, Ibaraki, Japan

Tsuyoshi Nakagawa

Nippon Avionics Co., Ltd., Yokohama, Kanagawa, Japan

Nobuaki Ebihara

NEC Toshiba Space Systems, Ltd., Fuchu, Tokyo, Japan

Fusao Iwase

Hirec Corp., Kawasaki, Kanagawa, Japan

Paper No. IPACK2011-52025, pp. 667-672; 6 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME


In the joint with eutectic Sn-Pb solder and a lead-free Ni/Pd/Au electrode, degradation of mechanical properties of the solder due to dissolution of Au and Pd into the solder would be anxious. In this study, the effect of aging was investigated on tensile properties and microstructures of the eutectic Sn-Pb solder with small amounts of Au and Pd added. In as-cast solders with both Au and Pd added, the tensile strength increases with increasing contents of Au and Pd. A similar tendency was observed after aging at 100°C for 1000 h. The effect of aging on elongation was relatively small and elongation degraded when brittle (Pd,Au)Sn4 phases formed in the solder. In solders with Au ranging from 1 to 5 mass%, regardless of aging conditions investigated, the tensile strength is stable at approximately 50 MPa and 45 MPa before and after aging, respectively. The effect of aging on improvement of elongation was negligible and elongation degraded when rod shaped AuSn4 formed in the solder. On the basis of the result of microstructural observation, it was clarified that the strengthening by dispersion of (Pd,Au)Sn4 phases is superior to softening by microstructure coarsening upon aging when the contents of Au and Pd are 2 mass% and 1 mass% or above, respectively.

Copyright © 2011 by ASME



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