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IC-Package Thermal Co-Analysis in 3D IC Environment

[+] Author Affiliations
Stephen H. Pan, Norman Chang, Ji Zheng

Apache Design Solutions, San Jose, CA

Paper No. IPACK2011-52240, pp. 335-341; 7 pages
doi:10.1115/IPACK2011-52240
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME

abstract

Power on chip is highly temperature dependent in deep sub-micron VLSI. With increasing power density in modern 3D-IC and SiP, thermal induced reliability and performance issues such as leakage power and electromigration must be taken into consideration in the system level design. This paper presents a new methodology and its applications to accurately and efficiently predict power and temperature distribution for 3D ICs.

Copyright © 2011 by ASME

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