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Submerged Jet Impingement Boiling on a Polished Silicon Surface

[+] Author Affiliations
Preeti Mani, Ruander Cardenas, Vinod Narayanan

Oregon State University, Corvallis, OR

Paper No. IPACK2011-52042, pp. 81-94; 14 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME


Submerged jet impingement boiling has the potential to enhance pool boiling heat transfer rates. In most practical situations, the surface could consist of multiple heat sources that dissipate heat at different rates resulting in a surface heat flux that is non-uniform. This paper discusses the effect of submerged jet impingement on the wall temperature characteristics and heat transfer for a non-uniform heat flux. A mini-jet is caused to impinge on a polished silicon surface from a nozzle having an inner diameter of 1.16 mm. A 25.4 mm diameter thin-film circular serpentine heater, deposited on the bottom of the silicon wafer, is used to heat the surface. Deionized degassed water is used as the working fluid and the jet and pool are subcooled by 20°C. Voltage drop between sensors leads drawn from the serpentine heater are used to identify boiling events. Heater surface temperatures are determined using infrared thermography. High-speed movies of the boiling front are recorded and used to interpret the surface temperature contours. Local heat transfer coefficients indicate significant enhancement upto radial locations of 2.6 jet diameters for a Reynolds number of 2580 and upto 6 jet diameters for a Reynolds number of 5161.

Copyright © 2011 by ASME
Topics: Polishing , Boiling , Silicon



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