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An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders

[+] Author Affiliations
Ram Ranjan, Jayathi Y. Murthy, Suresh V. Garimella

Purdue University, West Lafayette, IN

David H. Altman

Raytheon Integrated Defense Systems, Sudbury, MA

Paper No. IPACK2011-52039, pp. 69-80; 12 pages
doi:10.1115/IPACK2011-52039
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME

abstract

Passive phase-change thermal spreaders such as vapor chambers have been widely employed to spread the heat from small-scale high-flux heat sources to larger areas. In the present work, a numerical model for ultra-thin vapor chambers has been developed which is suitable for reliable predictions of the operation at high heat fluxes and small scales. The effects of boiling in the wick structure on the thermal performance are modeled and the model predictions are compared with experiments on custom-fabricated devices. The model predictions agree reasonably well with experimental measurements and reveal the input parameters to which thermal resistance and vapor chamber capillary limit are most sensitive.

Copyright © 2011 by ASME

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