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Robust Thermal Management for Embedded CPU and GPUs in Displays

[+] Author Affiliations
Sung Ki Kim, Woo Young Kan, Sang Hak Kim

Samsung Electronics, Suwon, Korea

Vincent Tan

Laird Technologies, Taipei, Taiwan

Gamal Refai-Ahmed, Ali Akbar Merrikh

Advanced Micro Devices, Austin, TX

Paper No. IPACK2011-52014, pp. 7-11; 5 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4462-5
  • Copyright © 2011 by ASME


Digital signage systems are large format displays that are typically installed in public areas for advertisement and informative publications. This emerging technology is considered as a major category in the large format display market. In general, a digital signage system consists of a flat panel display consisting of high brightness screen and operation circuits. Also, special features of high performance embedded computing system exist in very small form factors. Such products, however, are accompanied with high heat dissipation of the internal components and are usually exposed to very harsh environments for more frequent exposure to customers. Also the installation schemes of the products vary for different objectives, and a robust thermal design is required to guarantee the system reliability considering corner scenarios within the design space. The objective of the present study is to investigate the effect of installation environment on the thermal performance of a display assembly resembling a digital signage system. Design criteria for a proper thermal management scheme are proposed. The thermal characteristics of a digital signage system are presented in various operation conditions and each thermal design parameter is discussed thoroughly to ensure the reliability requirements of the digital signage system are met.

Copyright © 2011 by ASME



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