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Signal Integrity Analysis for RF System-in-Package

[+] Author Affiliations
Jeff Chen, Weiping Li

Jiangsu Changjiang Electronics Technology Co., Ltd., Jiangyin, Jiangsu, China

Feng Ling

Xpeedic Technology, Inc., Suzhou, Jiangsu, China

Paper No. IPACK2011-52282, pp. 671-674; 4 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME


RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.

Copyright © 2011 by ASME



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