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Use Condition Characterization of Package Components

[+] Author Affiliations
Leigh Wojewoda, Dhanya Athreya, Michael J. Hill

Intel Corporation, Chandler, AZ

Paper No. IPACK2011-52268, pp. 633-639; 7 pages
doi:10.1115/IPACK2011-52268
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

Discrete components, such as capacitors and inductors, play an important role in the analysis and design of electronic packages and printed circuit boards. Although the electrical parameters of discrete components are described by manufacturers, the component performance at product operating conditions can vary drastically from the manufacturer’s specification. Accurate characterization of discrete package components at operating conditions is essential to understand product operation. This paper will introduce a method to characterize discrete capacitors and inductors while applying multiple operating conditions simultaneously. Several inductor options will be evaluated, including a newly introduced metal composite component.

Copyright © 2011 by ASME

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