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Microprocessor Package Embedded Thin Film Capacitor for Power Delivery Improvement

[+] Author Affiliations
Michael J. Hill, Kemal Aygun, Kaladhar Radhakrishnan

Intel Corporation, Chandler, AZ

Paper No. IPACK2011-52254, pp. 627-631; 5 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME


The need for better high frequency performance, improved I/O power decoupling, and introduction of multi-chip processors are just some of the drivers for developing embedded capacitor technologies. One new technology, the Thin Film Embedded Package Capacitor (TFC) can target an improvement in the high frequency performance of the microprocessor power delivery network. Using this technology prototype packages for an Intel Microprocessor were fabricated and the impedance of the power delivery network (PDN) measured. The packages with the embedded TFCs demonstrated a reduction by more than a factor of 2 in the high frequency power delivery network impedance, and correspondingly improved voltage droop.

Copyright © 2011 by ASME
Topics: Thin films



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