Full Content is available to subscribers

Subscribe/Learn More  >

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

[+] Author Affiliations
Da Yu, Tung Nguyen, Ho H. Lee, S. B. Park

State University of New York at Binghamton, Binghamton, NY

Namseo Goo

Konkuk University, Seoul, Korea

Paper No. IPACK2011-52232, pp. 603-608; 6 pages
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME


The ever increasing power density in modern semiconductor devices requires heat dissipation solution such as heat sink to remove the heat away from the device. A compressive loading was applied to reduce the interfacial thermal resistance between package and heat sink. In this study both numerical modeling and experimental approaches were employed to study the effect of compressive loading on the interconnect reliability, especially for high power density package, under thermal cycling loading conditions. The JEDEC standard thermal cycle tests were conducted and the resistance of the daisy chained circuits was in-situ measured to record the failure time. The failure analysis has been performed to indentify the failure modes of solder joint with and without the presence of compressive loading. A finite element based thermal fatigue life prediction model for SAC305 solder joint under compressive loading was also developed and validated with the experimental results.

Copyright © 2011 by ASME
Topics: Reliability



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In