0

Full Content is available to subscribers

Subscribe/Learn More  >

Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer

[+] Author Affiliations
Minhua Lu, Paul Lauro

IBM T. J. Watson Research Center, Yorktown Heights, NY

Charles Goldsmith

IBM, Hopewell Junction, NY

Paper No. IPACK2011-52052, pp. 453-456; 4 pages
doi:10.1115/IPACK2011-52052
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

A study of NiFe alloy as under bump metallurgy (UBM) for Pb-free interconnect has been performed. Intermetallic growth rate of NiFe and SnAg solder is about 10x slower than that of Ni and SnAg solder. The thin and uniform intermetallic compound FeSn2 showed excellent thermal and electromigration stability. By slowing down or stopping the UBM dissolution, NiFe effectively eliminated the early EM fails that are common with Ni UBM. NiFe is an interesting candidate for the chip and substrate surface metallurgy of Pb-free interconnects for high power applications.

Copyright © 2011 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In