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Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

[+] Author Affiliations
Nobuyuki Shishido, Hisashi Sato, Shoji Kamiya, Masahiro Nishida

Nagoya Institute of Technology, Nagoya; JST CREST, Tokyo, Japan

Satoru Matsumoto, Chuantong Chen

Nagoya Institute of Technology, Nagoya, Japan

Masaki Omiya

Keio University, Yokohama; JST CREST, Tokyo, Japan

Takeshi Nokuo, Tadahiro Nagasawa

JEOL Ltd., Akishima; JST CREST, Tokyo, Japan

Takashi Suzuki, Tomoji Nakamura

Fujitsu Laboratories Ltd., Atsugi, Kanagawa, Japan

Paper No. IPACK2011-52270, pp. 425-428; 4 pages
doi:10.1115/IPACK2011-52270
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

Capability of detecting local interface strength variation with 10 ! m scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2 .

Copyright © 2011 by ASME

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