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SIF Evaluation Using XFEM and Line Spring Models Under High Strain Rate Environment for Leadfree Alloys

[+] Author Affiliations
Pradeep Lall, Mandar Kulkarni, Sandeep Shantaram, Jeff Suhling

Auburn University, Auburn, AL

Paper No. IPACK2011-52196, pp. 281-297; 17 pages
doi:10.1115/IPACK2011-52196
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

In this paper, fracture properties of Sn3Ag0.5Cu leadfree high strain-rate solder-copper interface have been evaluated and validated with those from experimental methods. Bi-material Copper-Solder specimen have been tested at strain rates typical of shock and vibration with impact-hammer tensile testing machine. Models for crack initiation and propagation have been developed using Line spring method and extended finite element method (XFEM). Critical stress intensity factor for Sn3Ag0.5Cu solder-copper interface have been extracted from line spring models. Displacements and derivatives of displacements have been measured at crack tip and near interface of bi-material specimen using high speed imaging in conjunction with digital image correlation. Specimens have been tested at strain rates of 20s−1 and 55s−1 and the event is monitored using high speed data acquisition system as well as high speed cameras with frame rates in the neighborhood of 300,000 fps. Previously the authors have applied the technique of XFEM and DIC for predicting failure location and to develop constitutive models in leaded and few leadfree solder alloys [Lall 2010a ]. The measured fracture properties have been applied to prediction of failure in ball-grid arrays subjected to high-g shock loading in the neighborhood of 12500g in JEDEC configuration. Prediction of fracture in board assemblies using explicit finite element full-field models of board assemblies under transient-shock is new. Stress intensity factor at Copper pad and bulk solder interface is also evaluated in ball grid array packages.

Copyright © 2011 by ASME
Topics: Alloys , Springs

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