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Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

[+] Author Affiliations
Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Yoshikatsu Nakano

Tohoku University, Sendai, Japan

Satoshi Watanabe, Motohisa Kuroha

Keihin Corporation, Takanezawa, Tochigi, Japan

Paper No. IPACK2011-52112, pp. 207-211; 5 pages
doi:10.1115/IPACK2011-52112
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

Due to environmental concerns, Pb-free solders are widely used in electronic industry for assembling electronic components on the substrate. Under the various operation conditions, solder bumps are subjected to cyclic stress and failed by fatigue. To ensure the reliability of electronic products, it is becoming important to predict the fatigue failure of the Pb-free solder bumps. In this study, effects of chip size and thermal amplitude on fatigue life of the Pb-free solder bumps were investigated by experiments and elastic-plastic finite element analysis. A parameter, which is valuable to compare the fatigue damage of electronic packages with different chip size, is introduced.

Copyright © 2011 by ASME

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