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The Effect of the Surface Roughness of Al Layer of DBA Substrate on Fatigue Life of Solder Joint in Power-Devices

[+] Author Affiliations
Shiqiang Zhao, Qiang Yu, Hiroki Akaeda

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. IPACK2011-52109, pp. 195-199; 5 pages
doi:10.1115/IPACK2011-52109
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

On the reliability evaluation, the phenomenon of surface roughness on the Al surface of DBA (Direct Brazed Aluminum) on power device is confirmed. This surface roughness is generated by cyclic thermal stress under thermal cycle test. In this study, the surface roughness characteristic after thermal cycle test is executed to DBA substrate and the generating mechanism was investigated. Furthermore, the effect on the fatigue life of solder joint on DBA substrate is also investigated.

Copyright © 2011 by ASME

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